Designed for solderless assembly, Vincotech MiniSKiiP PACK modules are an excellent first choice for your application or a perfect second source for Semikron’s product range.
The new MiniSKiiP PACK modules use the latest Infineon IGBT4 chip technology to improve EMC. They are available in three sizes targeting motor drive applications with up to 40 kW as well as power generation and UPS installations.
Available sizes:
MiniSKiiP 1 PACK - size 1 (42 x 40 mm²) covering 8 A 1200 V to 25 A 1200 V.
MiniSKiiP 2 PACK - size 2 (59 x 52 mm²) covering 35 A 1200 V to 70 A 1200 V.
MiniSKiiP 3 PACK - size 3 (82 x 59 mm²) covering 50 A 1200 V to 100 A 1200 V.
These MiniSKiiP PACK modules incorporate a 3-phase output inverter (SixPack topology) and an additional thermistor for temperature measurement. All Vincotech MiniSKiiP PACK products are also available on demand with pre-applied thermal grease for easy use and a perfect junction to the heat sink, as well as with lids in two different heights.
Vincotech MiniSKiiP PACK modules are pin-compatible with the previous versions of modules to enable quick upgrading. They are also fully compatible with their Semikron equivalents. Vincotech’s homepage provides cross-references, as well as data sheet and application note downloads.
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